Intel named Seok-Hee Lee, the former CEO of SK Hynix, as executive vice president of its foundry division, the company announced Thursday. The move signals a renewed push to strengthen its advanced packaging capabilities. Naga Chandrasekaran will separately lead front-end technology development and manufacturing.
Lee brings decades of experience from one of Intel's main rivals in memory chips and contract manufacturing. His appointment comes as Intel seeks to rebuild credibility in the foundry business after years of manufacturing missteps and market share losses to TSMC and Samsung.
The leadership shuffle arrives at a critical juncture for Intel. The firm is investing billions in new fabrication plants in the U.S. and Europe under the CHIPS Act. Yet it has yet to land a marquee external customer for its advanced 18A process node.
Analysts will watch whether Lee can accelerate client wins in high-performance computing and AI chips. His expertise in advanced packaging—a key differentiator in modern chipmaking—could prove pivotal. Success would help Intel claw back relevance in a market dominated by Asian foundries.
Some observers question whether leadership changes alone can solve Intel's deeper cultural and operational challenges. The company still faces an uphill battle convincing chip designers to trust its manufacturing over established rivals.